The layout mixes Intel's own processes with external foundry work. The graphics tile, with 4 Xe GPU cores, is built on Intel 3-E and covers roughly 26 mm², while a 72 mm² central hub die and a 58 mm² peripheral control tile both use Intel 18A-P. The main compute tile, hosting the 8P+16E core configuration, is the largest at 104 mm² and is made at TSMC on the N2P node. Two further tiles, a 21 mm² dummy die and an 85 mm² passive die, exist purely for the package's structural integrity.

The smaller "Nova Lake-H" follows the same recipe with a lighter compute tile: 4 P-Cores and 8 E-Cores on a 55 mm² TSMC N2P die, alongside the same Intel-made hub, control and graphics tiles. Its package shrinks to 12x23 mm, or 276 mm² in total, with a correspondingly smaller 45 mm² passive die.

On naming, previous rumours suggest the HX laptop chips may adopt the four-digit Core Ultra 4000 format already expected for desktop, while H-series and suffix-less mobile chips keep three-digit names. HX chips have traditionally been BGA versions of Intel's desktop silicon, so Intel appears to be grouping them with Nova Lake-S rather than the other laptop chips.