Intel has processed one million wafers using High-NA Extreme Ultraviolet lithography tools, a milestone that the company claims puts it ahead of the rest of the industry combined. Separately, Intel is advancing a project to create giant 6×12 photomasks to accelerate production and reduce costs.

High-NA EUV is a newer, more advanced form of lithography that uses a higher numerical aperture to print smaller features on silicon. Intel is also developing giant 6×12 photomasks, which are larger than the standard 6×6 format, to help speed up production and lower costs.