THE CRUNCH
Micron has demonstrated the world's first 512 GB DDR5 RDIMM server memory module, reaching speeds of up to 9200 MT/s. The product uses advanced vertical interconnect packaging to stack DRAM dies, allowing for up to 12 TB of capacity in a single server.
The new module is designed to support large and demanding workloads such as AI, analytics, and in-memory databases. AMD and Intel are actively validating the module, which will be available to enterprise data centre and cloud customers. The high capacity is achieved through the use of through-silicon vias (TSVs) to maximise density within individual DRAM packages.