According to repair technician @Modyficator89 on X, who opened a console from the Marvel's Wolverine Limited Edition Bundle and shared photos, the new board is labelled EDM-051. The most notable change sits on top of the processor: Sony still uses liquid metal as the thermal interface material between the APU and its heatsink, but the barrier around the chip has been reworked to leave less of the metal exposed. That should keep the compound sealed in place, reducing the chance of it spreading to nearby parts, which matters because liquid metal is highly conductive and can cause problems if it escapes.

The heatsink has also been rebuilt, apparently with different materials and construction than earlier units. TechPowerUp notes Sony took a similar approach with the PS5 Pro, so the Slim appears to be inheriting a proven design. Smaller revisions like this are routine for console makers, whose manufacturing runs span years.